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Rack Teardown Report

What is inside a GB200 NVL72 — every BOM line, who supplies it, and the $/M-token it implies.

Delivered2026-07-28

Prices have moved since this report: 9 price changes across 7 models since 2026-07-28.

This page is a snapshot. On the platform, these numbers reprice daily against the live catalogue.

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GB200 NVL72 Nvidia

NVLink-connected 72-GPU rack — the Blackwell-class scale-up unit. Liquid-cooled at ~120 kW. The current top-of-stack deployment.

72 accelerators/rack120 kWlifecycle 2025–2028price book as of 2026-07-03

Modeled BOM

$3,326,590

Approx. rack ASP

$3,000,000

Δ vs BOM: $-326,590 (integration + margin)

Cost pools

hbm$2,134,80064.2%
networking$291,0008.7%
other$212,0006.4%
optics$159,8404.8%
dram$151,2004.5%
packaging$150,0004.5%
cooling$147,7504.4%
power$80,0002.4%

Bill of materials

GroupLineQty$
COMPUTE72× B200 GPU (SXM6, 192 GB HBM3E)HBM3E 192 GB × 72 $208,800 · TSMC 4NP die × 72 $61,200 · CoWoS-L × 72 $79,200 · ABF substrate $36,000 · OSAT assembly $21,600 · Wafer probe + final test $28,800 · NVDA margin $1,699,20072$2,134,800
INTERCONNECT9× NVSwitch tray (5th-gen NVLink)NVSwitch ASIC die × 9 $13,500 · PCB + connectors × 9 $18,000 · NVDA margin + R&D + IP $148,5009$180,000
COOLING1× CDU (rack-level liquid cooling)Pumps + heat exchanger $29,750 · Controls + power module $15,000 · Cabinet + plumbing + integration $12,750 · Vertiv cooling margin + R&D $30,2501$87,750
POWERBusway + PDU + power shelf1$80,000
CHASSISRack chassis + assembly + integration1$150,000
NETWORKING8× BlueField-3 DPU8$20,000
STORAGELocal NVMe (per-tray)NAND flash $30,000 · HBA / controllers $10,000 · Enclosure + margin $10,0001$50,000
COMPUTE18× Grace CPU (Arm Neoverse)18$90,000
INTERCONNECT~600× PCIe Gen6 retimer (Astera Aries)Aries retimer ASIC $8,000 · PCB + packaging $3,000130$11,000
COOLINGCold plates + manifolds + tubing1$60,000
COMPUTESystem DRAM (LPDDR5X 8.64 TB in Grace CPU)1$151,200
COMPUTE9× GB200 compute tray9$72,000
INTERCONNECT144× 800G OSFP transceiverLaser/EML content $37,440 · DSP / SerDes $36,000 · Module assembly + margin $86,400144$159,840
INTERCONNECTNVLink copper backplane + cables1$80,000

Who gets paid (top suppliers per pool, modeled)

hbm

  • · NVDA$1,699,200
  • · TSM$140,400
  • · 000660$125,280

dram

  • · 000660$83,160
  • · MU$37,800
  • · 005930$30,240

networking

  • · NVDA$148,500
  • · TSM$13,500
  • · APH$8,100

optics

  • · 300308$44,525
  • · COHR$29,635
  • · 300502$28,080

cooling

  • · VRT$31,590
  • · 2308$28,080
  • · ETN$17,550

other

  • · 005930$9,000
  • · 000660$7,200
  • · AVGO$6,000

Modeled estimates from public market-share data — full allocation splits and monthly tracking are part of the AI Compute Cost Index (coming soon). Not investment advice.

Delivered by Mintok — AI infrastructure economics. This link is private to whoever holds it.